EC 57 Resin + W 57.01 Hardener
Filling and surface epoxy paste
EC 141 Resin + W 241 Hardener are a bicomponent, high-flow epoxy system designed for use in industry for rigid structure molds that need to be temperature resistant.
Filling and surface epoxy paste
EC 141 Resin + W 241 Hardener are a bicomponent, high-flow epoxy system designed for use in industry for rigid structure molds that need to be temperature resistant.
Package
Processing Instructions:
Check and, when necessary, homogenize the compounds before using them.
Add the correct amount of hardener to the resin, then mix it well, avoiding the insertion of air bubbles. The mixing process can be either manual or mechanical with a mixer. Apply it right away.
For surface preparation (molds and models) consult the bulletins for release agents (Separator Z 15 LC and Separator Z 25 LE). Let the mold cure at room temperature. Post curing is required to achieve the thermal resistance indicated in this bulletin.
Post curing:
The post curing process aims to obtain the maximum mechanical performance that the material can offer. All room temperature cured systems should be post cured for increased performance, especially if they are going to operating at high temperatures. After 24 h of curing at room temperature, the material must be heated at 100°C for 3 – 4. These parameters may change according to the piece size (for larger pieces, the post curing time must be longer). In case of thin layer applications, the post curing process must be done with the part in the jig
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